Auxiliary cooling methods and systems for electrical device housings
US7272002B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 16, 2005 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | Dec 7, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods and systems for auxiliary cooling of electrical device housings are provided. In one embodiment, an electronics device enclosure system is provided. The system comprises a housing, wherein the housing encloses one or more electronic devices; a backplane situated within the housing wherein at least one of the one or more electronic devices are coupled to the backplane; and an auxiliary cooling system coupled to the backplane and adapted to receive electrical power from one or more power sources, wherein the auxiliary cooling system comprises one or both of a thermoelectric cooling module and a fan, and wherein the auxiliary cooling system is adapted to increase the heat transfer from the one or more electronic devices to an environment external to the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.