System and method for analyzing and identifying flaws in a manufactured part
US7272254B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2003 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | Dec 14, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system and method for identifying flaws in a part being inspected includes generating a 3-d representation of the part, the 3-d representation comprising 3-d spatial coordinates corresponding to different locations on the part, and registering the 3-d spatial coordinates with corresponding locations of a part being inspected. An image of the part being inspected is generated, and a flaw in the part being inspected is identified from the generated image. A location of the flaw is correlated to a corresponding 3-d spatial coordinate, and a device is controlled to perform an operation on the part being inspected at the flaw location using information of the corresponding 3-d spatial coordinate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.