Method, system, and program product for boundary I/O testing employing a logic built-in self-test of an integrated circuit
US7272764B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2004 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | Jun 15, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/318541
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A testing method is provided which includes verifying at least one external signal path of an electronic package environment by testing an input/output (I/O) circuit of an integrated circuit of the electronic package environment with a logic built-in self-test (LBIST) of the integrated circuit, wherein the external signal path being verified is electrically coupled to the tested I/O circuit. A result of verifying of the at least one external signal path is manifested in the integrated circuit's signature, which characterizes a response of the I/O circuit to the LBIST. In another aspect, the verifying of the at least one external signal path includes concurrently testing another I/O circuit of another integrated circuit, which is also electrically coupled to the external signal path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.