Micro-fluid ejection assemblies
US7273266B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2004 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Dec 7, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1628
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A micro-fluid ejection assembly including a silicon substrate having accurately formed fluid paths therein. The fluid paths are formed by a deep reactive ion etching process conducted on a substrate having a surface characteristic before etching selected from the group consisting of a dielectric layer thickness of no more than about 5000 Angstroms, and a substantially dielectric material free pitted surface wherein a root mean square depth of surface pitting is less than about 500 Angstroms and a maximum surface pitting depth is no more than about 2500 Angstroms. Fluid paths in such substrates having improved flow characteristics for more reliable fluid ejection operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.