Method and apparatus for through-hole placement in a building structure
US7273332B2 · kind B2 · utility
1Cited by
24References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2004 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Oct 29, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T408/553
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for creating a through-hole in a building structure includes selecting a first location on a first side of the building structure that will define a first opening of the through-hole; disposing a magnet at the first location; selecting a second location on a second side opposite the first side via a magnetic pointer magnetically pointing to the magnet; and drilling the through-hole from the second side through the building structure in a direction indicated by the magnetic pointer creating the through-hole defined by the first and second openings on the first and second sides, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.