System and method for monitoring laser shock processing
US7273998B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2004 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Sep 26, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D11/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and system for monitoring laser shock peening of a work piece. A line spectrum is obtained from radiation emitted by a plasma produced by a laser shock peening process. The shape of the line spectrum about its emission peak is compared to a defined line shape to verify proper operation of the laser shock peening process. The line shape may be a Lorentzian line shape corresponding to a desired line shape. The line shape may a Gaussian line shape corresponding to an undesired line shape. The system can also detect the failure mode that occurs when the opaque layer is broken through by detecting the plasma spectral component produced by the work piece material, along with the plasma produced by the opaque layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.