Surface acoustic wave device and method of fabricating the same
US7274129B2 · kind B2 · utility
4Cited by
4References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 30, 2004 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Jan 29, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A surface acoustic wave device includes, a first substrate, a surface acoustic wave chip attached to the first substrate, and a second substrate that hermetically seals the surface acoustic wave chip. At least one of the first and second substrates includes. The first and second substrates have respective joining surfaces. An electric circuit is formed on a surface area of the first substrate other than the joining surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.