RFID tag and method of manufacture
US7274297B2 · kind B2 · utility
8Cited by
10References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2004 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Feb 19, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An RFID tag may include an antenna substrate comprising a conductive layer etched or deposited to form an antenna, and a circuit substrate comprising a conductive layer etched or deposited to form a circuit, the antenna electro-magnetically coupled to the circuit. An RFID tag may be formed from an insert substrate comprising an insulative layer between two conductive layers, one of the conductive layers etched to form an antenna and the other conductive layer etched to form a circuit. The insert substrate may be received in an envelope formed by a label substrate, which may carry a pressure sensitive adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.