Method and apparatus for monitoring integrated circuit temperature through deterministic path delays
US7275011B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2005 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Jul 27, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K3/10
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for monitoring the temperature of an integrated circuit device includes a conductive wiring pattern formed on the integrated circuit device, extending into areas of the device to be monitored. A deterministic signal source is configured to generate a deterministic signal along the conductive wiring pattern, with one or more return paths tapped from selected locations along the pattern. A temperature change determination circuit is coupled to the one or more return paths and to a reference signal taken from the deterministic signal source. The circuit is configured to determine a delay between the reference signal and a delay signal traveling through at least a portion of the wiring pattern and a corresponding one of the return paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.