Method for fabricating an acoustical resonator on a substrate
US7275292B2 · kind B2 · utility
97Cited by
22References
11Claims
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Key dates
| Filing date | Mar 7, 2003 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | Jun 5, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Method for fabricating an acoustical resonator on a substrate having a top surface. First, a depression in said top surface is generated. Next, the depression is filled with a sacrificial material. The filled depression has an upper surface level with said top surface of said substrate. Next, a first electrode is deposited on said upper surface. Then, a layer of piezoelectric material is deposited on said first electrode. A second electrode is deposited on the layer of piezoelectric material using a mass load lift-off process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.