Substrate supporting apparatus
US7275749B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2004 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | Jan 8, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/18
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate supporting apparatus for supporting a substrate or wafer in a non-contact state by Bernoulli theorem is disclosed. The substrate supporting apparatus 1 comprises a housing 2, a rotatable chuck 3 which is disposed in the housing 2, which is provided at its central portion with a hollow 12 and which supports a substrate 6, and a cylindrical nozzle member 4 which is disposed in the housing 2, which has a nozzle hole 7 and which can vertically move in the hollow 12. A nozzle hole 7 is formed in a central portion of the nozzle member 4. Gas is discharged from a gas source 8 through the nozzle hole 7, thereby holding the substrate 6 by an upper surface of the chuck 3 in a non-contact state. When the substrate 6 is to be detached, the nozzle member 4 is moved upward while discharging gas from the nozzle hole 7, thereby floating the substrate 6.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.