Apparatus for forming a striation reduced chemical mechanical polishing pad
US7275928B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2004 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | Oct 7, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C39/44
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides an apparatus for forming a chemical mechanical polishing pad, comprising a tank with polymeric materials, a storage silo with microspheres and a curative storage tank with curing agents. The apparatus further provides a premix prep tank for forming a pre-mixture of the polymeric materials and the microspheres and a recirculation loop in the premix prep tank for recirculating the pre-mixture until a desired bulk density is reached. The apparatus further provides a premix run tank for storing the pre-mixture, a mixer for forming a mixture of the pre-mixture and the curing agents and a mold for molding the mixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.