Method for the manufacture of an injection molded conductor carrying means
US7276267B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 11, 2003 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | Apr 19, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0014
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method making possible the production of an injection molded conductor carrying means composed of a first supporting substrate and a second supporting substrate. The first supporting substrate comprises a basically metallizeable plastic material and the second supporting substrate a basically non-metallizeable plastic material. However the plastic material of the second supporting substrate is able to be activated by a laser beam. The laser activation produces a metallization pattern on it and such pattern is connected with uncovered areas of the first supporting substrate, following which a common treatment takes place which results in an electrical conductor arrangement being produced. The invention furthermore relates to a conductor carrying means produced by the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.