Methods of laser repairing a circuit, compositions and equipment for such methods, and structures formed from such methods
US7276385B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2003 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | May 26, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for repairing an electrical circuit; compositions, inks and equipment for making such repairs; and repair structures formed by the methods. The method generally includes the steps of: (a) depositing a composition comprising nanoparticles of an electrically functional material such that it contacts first and second elements of the circuit; and (b) sufficiently irradiating at least part of the composition with light to fuse or bind the nanoparticles to each other. The composition and ink generally comprise such nanoparticles and a sensitizer having a light absorption maximum at a wavelength different from that of the nanoparticles. The apparatus comprises: (1) a deposition apparatus configured to deposit a liquid film of an electrically functional material on the circuit; (2) a light source configured to irradiate at least part of the thin film; and (3) a table configured to secure the substrate. The structure generally comprises a circuit element having an electrical disconnect, and a cured electrically functional material (i) in electrical contact with first and second locations on the circuit elements adjacent to the disconnect, and (ii) forming a continuous electrical pat…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.