Manufacturing method for electronic component module and electromagnetically readable data carrier
US7276436B2 · kind B2 · utility
9Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2003 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | Oct 18, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1189
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor bear chip having a bump subjected to high temperatures is pressed, from the upper side, onto a wiring board including a wiring pattern, a thermosetting resin film covering an electrode area on the wiring pattern and having insulating particles dispersed and included and a thermoplastic resin film covering the thermosetting resin film, while applying a ultrasonic wave, thereby inserting the bumps of the semiconductor bear chip through the thermoplastic resin film and the thermosetting resin film to bond the top end portion of the bump with the electrode area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.