Semiconductor device and chip-stack semiconductor device
US7276780B2 · kind B2 · utility
15Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2006 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | Jun 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has multiple power-supply through electrodes, grounding through electrodes, and signal-routing through electrodes made through a semiconductor chip. The power-supply through electrodes, the grounding through electrodes, and the signal-routing through electrodes differ mutually in cross-sectional area. Hence, a semiconductor device and a chip-stack semiconductor device are provided which are capable of preventing the electrodes' resistance from developing excessive voltage drop, heat, delay, and loss, and also from varying from one electrode to the other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.