Semiconductor device and a method of assembling a semiconductor device
US7276784B2 · kind B2 · utility
4Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2005 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | Oct 11, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15331
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a base substrate; a first fixing layer provided on the base substrate; a first semiconductor chip fixed on the first fixing layer; a first substrate provided above the first semiconductor chip; a plurality of first connection members isolated from the first semiconductor chip, electrically connecting to the first substrate with the base substrate; and a first encapsulating layer provided around the first connection members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.