Heat dissipation device having a dual-fan arrangement
US7277280B2 · kind B2 · utility
60Cited by
8References
18Claims
0Family size
Assignees
Inventor
Key dates
| Filing date | Nov 25, 2005 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | Jan 21, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a heat sink (22), a first fan (24) disposed on one part of the heat sink, a second fan (26) disposed on another part of the heat sink and a cover (30) disposed to enclose the heat sink, the first fan and the second fan. The second fan draws the air produced by the first fan and flowing through the heat sink to quickly leave the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.