Integrated circuit cooling system including heat pipes and external heat sink
US7277282B2 · kind B2 · utility
58Cited by
24References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 27, 2004 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | Nov 17, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes an integrated circuit (IC) package and a heat sink having a base and a plurality of fins extending from the base. The apparatus further includes a plurality of heat pipes. Each heat pipe has a first end and a second end. The first ends of the heat pipes are thermally coupled to the IC package, and the second ends of the heat pipes are thermally coupled to the base of the heat sink to transfer heat from the IC package to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.