Capacitive micro pressure sensing member and fingerprint sensor using the same
US7277563B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 12, 2003 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | Nov 15, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L1/148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A capacitive micro pressure sensing member and a fingerprint sensor using the same. The sensing member includes a substrate, a first suspended structure, a first protrusion structure, and a second suspended structure. The first suspended structure is located above the substrate and includes a suspended thin plate and at least one compliant suspension arm connected to the suspended thin plate, which is movable so that a distance from the suspended thin plate to the substrate is changed. The first protrusion structure is arranged at a center portion of a top surface of the suspended thin plate. The second suspended structure is arranged on a top surface of the first protrusion structure with a center portion of the second suspended structure contacting the first protrusion structure. The second suspended structure covers the first suspended structure to form a sealed chamber together with the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.