Thermal isolation between heating and sensing for flow sensors
US7278308B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2005 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | Dec 8, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01F1/684
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A flow sensor system includes a plurality of flow sensor chips, wherein each flow sensor chip among the plurality of flow sensor chips comprises a substrate, a heater element, a heater control circuit, and flow sensor component formed on the substrate, wherein the heater element is disposed separately from the heater control circuit on the substrate, wherein the heater control circuit is thermally isolated from the heater element and the flow sensor component. Additionally, an air gap can be formed between each sensor chip among the plurality of flow sensor chips, wherein the plurality of flow sensor chips comprises a flow sensor system in which each of the flow sensor chips are separated from one another by the air gap formed therebetween in order to reduce output distortion, response time, warm-up time, drift and noise associated with the plurality of flow sensor chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.