Liquid-cooled heat radiator kit
US7278467B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2005 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | Apr 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A liquid-cooled heat radiator kit is disclosed to include a heat radiator, which has radiation elements at the top wall and parallel grooves at the bottom wall, two liquid-cooled heat pipes bilaterally arranged in parallel at the bottom side of the heat radiator, each liquid-cooled heat pipes having two close ends and a plurality of enclosed chambers spaced between the two close ends, and a plurality of straight flow-guide pipes respectively fastened to the grooves at the bottom side of the heat radiator and connected between the two liquid-cooled heat pipes to form with the enclosed chambers of the liquid-cooled heat pipes a detoured flow passage for the passing of a cooling fluid in one direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.