Silica and silica-based slurry
US7279119B2 · kind B2 · utility
27Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2003 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | Oct 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This invention relates to a silica, a slurry composition, and a method of their preparation. In particular, the silica of the present invention includes aggregated primary particles. The slurry composition which incorporates the silica, is suitable for polishing articles and especially useful for chemical-mechanical planarization of semiconductor substrates and other microelectronic substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.