Apparatus and test device for the application and measurement of prescribed, predicted and controlled contact pressure on wires
US7279916B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 17, 2005 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | Feb 1, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The mechanical behavior of wires subjected to axial loading and experiencing bending deformation is used to ensure effective control of the contact pressure in mechanical and/or heat removing devices, and similar structures and systems. An apparatus for taking advantage of the characteristics of wires in packaging of a device, such as a semiconductor device, is disclosed, as well as a test device for identifying the accurate contact pressure required in same. Methods for the prediction of such a behavior for pre-buckling, buckling, and post-buckling conditions in wires, carbon nanotubes (CNTs), and similar wire-grid-array (WGA) structures, for example are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.