Air cooling architecture for orthogonal board architectures
US7280356B2 · kind B2 · utility
56Cited by
6References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2004 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | Jul 11, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20563
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic system is disclosed that uses air for cooling first and second orthogonally oriented arrays of parallel circuit boards. Air is drawn into the front of the system, passes alongside the circuit boards in the first array, takes a 90-degree turn, continues over the circuit boards in the second array, and takes another 90-degree turn to exhaust through the rear of the system. The circuit boards in the first array are cooled through a separate airflow path, which preferably also runs front-to-rear.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.