Apparatus for controlling thermal interface between cold plate and integrated circuit chip
US7280363B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2005 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | Nov 21, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a heat sink device for receiving heat generated by an electrical chip. The heat sink device includes a cold plate having a bottom surface for receiving heat from the electrical chip and a top surface opposite of the bottom surface. The heat sink device also includes a finger member having a rounded tip centered on the top surface. The heat sink device also includes a force generating device having an anvil spaced from the finger member and a compressible member compressed between the anvil and the finger member. The compressible member generates a pressing force urging the finger member and the top surface together. The heat sink device also includes a moving device operable to move one of the anvil and the finger member relative to the other to change the pressing force generated by the compressible member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.