Apparatus and method for multiprocessor circuit board
US7280364B2 · kind B2 · utility
12Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2004 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | Oct 20, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1056
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.