System and method for housing power supplies in an electronic device
US7280366B1 · kind B1 · utility
4Cited by
15References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2004 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | Feb 1, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1457
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A housing for an electronic device has a first volume bounded by a first face and a second volume bounded by a second face. The second face is indented from the first face. A plurality of electronic components are housed in the first volume, and one or more power supplies are housed in the second volume. The electronic components are operable to be powered by a coupling to the one or more power supplies, the coupling running between the indented second face and the first face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.