EMI shielding techniques using multiple EMI shields which share the same circuit board holes
US7280368B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2005 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | Nov 29, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0033
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board module includes a circuit board defining a top side, a bottom side and holes extending through the circuit board between the top and bottom sides. The module further includes a component mounted to a portion of the circuit board, and an EMI shield assembly configured to provide EMI shielding on the circuit board. The EMI shield assembly includes a top shield and a bottom shield. The top and bottom shields are configured to substantially enclose the portion of the circuit board and the component to provide EMI shielding when (i) contacts of the top shield insert into the holes defined by the circuit board in a first direction from the top side toward the bottom side, and (ii) contacts of the bottom shield simultaneously insert into the same holes defined by the circuit board in a second direction from the bottom side toward the top side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.