Method of manufacturing circuit board
US7281325B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2004 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Sep 2, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pre-preg sheet includes a substrate and a resin impregnated in the substrate. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a softening temperature of the resin. The laminated body is compressed at the temperature at a predetermined pressure. The first metal foil is bonded to the pre-preg sheet of the laminated body and hardening the resin, thus providing a circuit board. This method provides a stable resistance of a conductive paste filing a through-hole in the pre-preg sheet to be compressed at a small rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.