Method of fabricating rigid-flexible printed circuit board
US7281328B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2005 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Oct 18, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is related to a method of fabricating a rigid-flexible printed circuit board. Specifically, this invention relates to a method of fabricating a rigid-flexible printed circuit board, in which an internal circuit pattern exposed for use in an external pad and a mounting pad is protected from external environments using a resist cover by window etching the base copper foil of a flexible region upon formation of an external circuit pattern as opposed to using a resist cover. Thus the number of fabrication processes and the fabrication costs are decreased and the increase in defect rates due to contamination is prevented, resulting in maximized reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.