Composite sputter target and phosphor deposition method
US7282123B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 15, 2003 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Jun 26, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/548
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention is a novel sputter target and deposition method for multi-element thin film phosphors for thick film dielectric electroluminescent displays in which the deposited phosphors provide a high luminance and colors required for TV applications. The method comprises sputtering a single composite target in a low pressure sputtering atmosphere that comprises gases containing reactive species and non-reactive species. The composite target comprising a matrix phase and an inclusion phase, or two matrix phases, wherein one of the phases comprises one or more metallic elements that contribute to the composition of the phosphor and the other of the phases comprises the remaining elements that contribute to the composition of the phosphor. In the method the pressure of the reactive species within the sputtering atmosphere is varied to control the sputtering rate of the matrix and inclusion phases of the composite target to cause the ratio of the elements in the two phases to deposit in a desired ratio as a phosphor film on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.