Doughnut like dumpling covered with sesame seeds, dough used for preparing the doughnut and method for the preparation of the doughnut
US7282231B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2003 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Jul 1, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S426/808
- WIPO fieldFood chemistry
- WIPO sectorChemistry
Abstract
A doughnut like a dumpling covered with sesame seeds is prepared using a powdery raw material, which comprises 50 to 80 parts by weight of ungelatinized starch, 6 to 25 parts by weight of pregelatinized starch, 7 to 30 parts by weight of wheat flour and 7 to 25 parts by weight of a saccharide. Dough used for the preparation of a doughnut like a dumpling covered with sesame seeds is obtained by adding water and, if needed, a seasoning component to the foregoing powdery raw material to thus form dough, dividing the resulting dough into small pieces and forming each small piece into a desired shape and, if needed, stuffing the shaped dough with fillings. The foregoing doughnut can be prepared by frying the foregoing dough. The doughnut like a dumpling covered with sesame seeds is excellent in the storage stability and has excellent sticky and resilient feeling upon eating like a rice cake.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.