Replaceable plate expanded thermal plasma apparatus and method
US7282244B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2003 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Jan 19, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32357
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a deposition process for plasma enhanced chemical vapor deposition of a coating on a substrate. The process comprises detennining a target process condition within a chamber of an expanding thermal plasma generator; the generator comprising a cathode, a replaceable cascade plate and an anode comprising a concentric orifice; and thereafter replacing the cascade plate with another plate having a configured orifice to effect the identified target process condition. The plasma is then generated at the target process condition by providing a plasma gas to the plasma generator and ionizing the plasma gas in an arc between cathode and anode within the generator and expanding the gas as a plasma onto a substrate in a deposition chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.