Surface coating for electronic systems
US7282254B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2004 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Jun 10, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/268
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bi- or multi-layer coating is deposited upon a substrate using a low temperature process. The bi-layer is a lower layer of a SAM coating, which is overlaid with a hard coating. The hard coating can be made of materials such as: polymer, Si3N4, BN, TiN, SiO2, Al2O3, ZrO2, YSZ, and other ceramic materials, and the underlying, compliant, SAM coating can comprise substances containing long chain molecules that chemically bond to the substrate. This bi-layer provides both environmental and hermetical protection to electronic hardware and MEMS systems, without employing expensive packaging materials and processes. Multiple bi-layers may be combined to form multi-layer coatings. A protective polymer or other material may optionally be formed as an outside layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.