Highly heat-resistant, negative-type photosensitive resin composition
US7282323B2 · kind B2 · utility
9Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2003 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Jul 10, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/035
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is a negative type photosensitive resin composition comprising (A) a polyamide having a photopolymerizable unsaturated double bond, (B) a monomer having a photopolymerizable unsaturated double bond, (C) a photopolymerization initiator and (D) a melamine resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.