Substrate and method of forming substrate for fluid ejection device
US7282448B2 · kind B2 · utility
2Cited by
28References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2005 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Jan 14, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3103
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced etch stops in the first side of the substrate, etching into the substrate from the second side toward the first side to the spaced etch stops, and etching into the substrate between the spaced etch stops from the second side. Etching into the substrate to the spaced etch stops includes forming a first portion of the opening and etching into the substrate between the spaced etch stops includes forming a second portion of the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.