Apparatus for improving coupling across plane discontinuities on circuit boards
US7282647B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2002 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | May 4, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.