Surface mount type semiconductor device and lead frame structure thereof
US7282785B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 14, 2004 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Sep 14, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
Abstract
A surface mount type semiconductor device can be configured to include a pair of lead frames that are butted to each other with a spacing such that ends of the lead frames are opposite to each other. A bare chip can be mounted on a chip mount portion on one end side of one of the lead frames, and wire-bonded to a connection portion on an end side of the other lead frame. A housing can be insert-molded to an end side of both of the lead frames, and the lead frames can be shaped such that they extend along the side and bottom surfaces of the housing and form surface mounting terminal portions. The lead frames are preferably formed to be thin at least at the regions that are to be bent, and other regions thereof are preferably formed to be thick to improve heat radiating effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.