Electronic circuit protection device
US7282906B2 · kind B2 · utility
2Cited by
9References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 20, 2006 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Apr 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for protecting an electronic circuit comprising a support to which are attached at least two circuit portions, each comprising at least one integrated circuit chip. The device comprises a wafer of a semiconductor material covered with a conductive layer arranged parallel to the support, the wafer being connected to the support by conductive pillars distributed around each circuit portion and in contact with the conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.