Patent · US Expired

Reconfigurable processor module comprising hybrid stacked integrated circuit die elements

US7282951B2 · kind B2 · utility

295Cited by
10References
29Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 12, 2006
Grant dateOct 16, 2007
Priority date—
Expiry dateMay 12, 2026

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02D10/00
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.