Heat dissipation device having a locking device
US7283362B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 26, 2005 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Feb 16, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a retention module, a heat sink, a locking plate and a clip rotatably connecting with the retention module. The retention module includes an opening in a center thereof. The heat sink includes a heat conducting body and plurality of fins radially extending from the heat conducting body. The heat conducting body has a bottom portion received in the opening of the retention module. The locking plate engages with the bottom portion of the heat conducting body of the heat sink. The locking plate has a first portion abutting a bottom of the retention module, and a second portion opposite to the first portion. The second portion is pressed by a pressing portion of the clip when the heat dissipation device is at a locked position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.