Printed circuit board and method of making the same
US7284224B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 7, 2005 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Dec 7, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB) includes a base board, a conductive pattern arranged on the base board, and a number of metal pads arranged on the base board. The conductive pattern includes a number of vias and traces. The metal pads are evenly arrayed where there is a sparsity of vias and traces to balance a current during a plating process for achieving an even plating thickness. A method of designing the PCB includes: simulating a PCB with electronic components using a software, simulating vias, traces, and metal pads, and testing the electrical characteristics of the whole simulation. If the simulated PCB fails testing then it is redesigned. Once a simulated PCB passes testing then it is ready to be manufactured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.