Process for producing electro-optic hybrid circuit board
US7284322B2 · kind B2 · utility
1Cited by
1References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2005 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Mar 15, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a process for producing an electro-optic hybrid circuit board, which comprises the steps of: forming an undercladding layer on a metal foil side of a metal transfer sheet that comprises a releasable substrate and a metal foil formed thereon; forming a core layer on the undercladding layer; forming an overcladding layer so as to cover the core layer and the undercladding layer; stripping the releasable substrate from the metal foil; and etching the metal foil to thereby form a predetermined conductor pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.