Method and apparatus for network with multilayer metalization
US7285487B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2004 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | May 15, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K19/17796
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A network for interconnecting processing element nodes which supports rich interconnection while having a number of switching elements which is linear in the number of processing elements interconnected. Processing elements connect to the lowest level of the tree and the higher levels of the tree make connections between the processing elements. The processing elements may be laid out in a two dimensional grid and one or more horizontal and vertical trees may be used to connect between the processing elements with corner switches used to connect between the horizontal and vertical trees. The levels of the tree can be accommodated in multiple layers of metalization such that the entire layout requires a two-dimensional area which is linear in the number of processing elements supported.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.