Wavelength conversion chip for use in solid-state lighting and method for making same
US7285791B2 · kind B2 · utility
25Cited by
4References
21Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 24, 2006 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Mar 24, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8516
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A wavelength conversion chip is formed by depositing a wavelength conversion material layer on a substrate, segmenting the wavelength conversion layer into a plurality of wavelength conversion chips, and then removing the wavelength conversion chips from the substrate. The wavelength conversion of the chips can be increased by thermal annealing or radiation annealing of the wavelength conversion material. Optical coatings or light extraction elements can be fabricated on the wavelength conversion layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.