Illumination assembly and method of making same

US7285802B2 · kind B2 · utility

Assignee

• 3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

• Andrew J. Ouderkirk · Windom, US
• Hung T. Tran · Woodbury, US
• John C. Schultz · Afton, US
• John A. Wheatley · Stillwater, US
• Joseph A. Hoffman · Minneapolis, US
• Kay-Uwe Schenke · Neuss, DE
• Michael A. Meis · Stillwater, US
• Stephen J. Pojar · Scandia, US
• Wolfgang N. Lehnhardt · Mülheim an der Ruhr, DE

Key dates

• Filing date: Dec 21, 2004
• Grant date: Oct 23, 2007
• Expiry date: Jan 24, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/856
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

An illumination assembly including a thermally conductive substrate, a patterned conductive layer proximate a major surface of the thermally conductive substrate, a dielectric layer positioned between the patterned conductive layer and the major surface of the substrate, and at least one LED including a post that is attached to the thermally conductive substrate such that at least a portion of the post is embedded in the thermally conductive substrate is disclosed. The at least one LED can be thermally connected to the thermally conductive substrate through the post and electrically connected to the patterned conductive layer. The dielectric layer can be reflective.