Multiple internal seal right micro-electro-mechanical system vacuum package

US7285844B2 · kind B2 · utility

Assignees

• CALIFORNIA INSTITUTE OF TECHNOLOGY · US
• The Boeing Company · US

Inventors

• Ken J. Hayworth · San Fernando, US
• Karl Y. Yee · Pasadena, US
• Kirill V. Shcheglov · Los Angeles, US
• Youngsam Bae · Gardena, US
• Dean Wiberg · La Cañada Flintridge, US
• A. Dorian Challoner · Manhattan Beach, US
• Chris S. Peay · Alhambra, US

Key dates

• Filing date: Jun 10, 2004
• Grant date: Oct 23, 2007
• Expiry date: May 15, 2025

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B7/007
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum package that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.