Method and apparatus for connecting metal structures on opposing sides of a circuit
US7286325B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2004 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Dec 2, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/4853
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to an embodiment of the present invention, an improved method and system are provided. In one embodiment, a conductive connection is made between two metal layers separated by an intermediate insulating layer by providing vias between one of the metal layers and the insulating layer. A conductor, such as a conductive sphere made of gold is disposed into the vias and pressed so as to create a conductive connection between the metal layers. In a further embodiment, vias are created in both metal layers. In such a case, a fixture support may be provided so that when the conductive sphere is pressed into the vias, it is also pressed into the support to improve the conductive connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.