Thermally expanding base of heatsink to receive fins
US7286352B2 · kind B2 · utility
12Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2005 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Nov 26, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments include apparatus, methods, and systems providing a heatsink for electronic heat generating components. In one embodiment, the heatsink includes a metal base having a plurality of grooves, and a plurality of graphite fins connected to the base. The fins thermally dissipate heat from the base and into a surrounding environment. The fins are secured within the grooves with an interference fit produced by thermally expanding the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.